



A97 MTK and Spreadtrum (16) new models
A97 Universal IC Reballing Sheet BGA Stencils for Samsung HTC Huawei Android Button Mobile Directly Heated Mediatek MTK Spreadtrum Ram Rom Power Management Chip RF Transceiver GSM GPRS SoC Reballing Stencils Kit
KLM8G1WEMB-B031, MT6582, KMR820001M-B609, TYCOFH121638RA G557581525KRD, MTK6572A, MT6580A, SC7715A, SC7731G, MT6261mA, MT8392V, MT6582V, MT6582V, SC6531DA, MT6290MA, MT6595W, SC9830A, MT6735V, MT6592, 6323GA, MT6165V, MT6592, MT6369A, MT6572A, MT6579A, MT6169V
BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template
High Quality Stainless Steel BGA Reballing Stencil.
Specially Designed for HUAWEI XIAOMI LG OPPO MEIZU Samsung MTK MAX WTR
Make your repair work easier.
Color : Silver
Feature : Square Hole -We promised all the plate boards are in Brand New condition,but this item is easy to get scratched.
- A97 MTK and Spreadtrum (16) new models
- A97 Universal IC Reballing Sheet BGA Stencils for Samsung HTC Huawei Android Button Mobile Directly Heated Mediatek MTK Spreadtrum Ram Rom Power Management Chip RF Transceiver GSM GPRS SoC Reballing Stencils Kit
- KLM8G1WEMB-B031, MT6582, KMR820001M-B609, TYCOFH121638RA G557581525KRD, MTK6572A, MT6580A, SC7715A, SC7731G, MT6261mA, MT8392V, MT6582V, MT6582V, SC6531DA, MT6290MA, MT6595W, SC9830A, MT6735V, MT6592, 6323GA, MT6165V, MT6592, MT6369A, MT6572A, MT6579A, MT6169V
- BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template
- High Quality Stainless Steel BGA Reballing Stencil.
- Specially Designed for HUAWEI XIAOMI LG OPPO MEIZU Samsung MTK MAX WTR
- Make your repair work easier.
- Color : Silver
- Feature : Square Hole -We promised all the plate boards are in Brand New condition,but this item is easy to get scratched.
Login to ask a question