Universal Bga Stencil For Android Qualcomm HiSilicon Mtk Msm Sa OV Max Ipad Cpu Ram Pm Power Ic Reballing Stencil Tin Plate for Xiaomi Realme Oppo Vivo Samsung

Name: Universal Bga Stencil For Android Qualcomm HiSilicon Mtk Msm Sa OV Max Ipad Cpu Ram Pm Power Ic Reballing Stencil Tin Plate for Xiaomi Realme Oppo Vivo Samsung
SKU: MOS896149
Price: 260.00 BDT
Availability: InStock

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SKU: MOS896149

Seller: Module Shop

Tk 260

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A103 Universal Bga Stencil For Android Qualcomm HiSilicon Mtk Msm Sa OV Max  Ipad Cpu Ram Pm Power Ic Reballing Stencil Tin Plate for Xiaomi Realme Oppo Vivo Samsung
Universal Bga Stencil for Android Qualcomm, HiSilicon, Mtk, Msm.
Compatible with Xiaomi, Realme, Oppo, Vivo, Samsung and more.
Ideal for reballing stencil tin plate for various CPU and RAM.
Suitable for soldering and fastening in DIY and outdoor projects.

Call For Order : 09613-800800

Universal Bga Stencil For Android Qualcomm HiSilicon Mtk Msm Sa OV Max Ipad Cpu Ram Pm Power Ic Reballing Stencil Tin Plate for Xiaomi Realme Oppo Vivo Samsung

Universal Bga Stencil for Android Qualcomm, HiSilicon, Mtk, Msm.
Compatible with Xiaomi, Realme, Oppo, Vivo, Samsung and more.
Ideal for reballing stencil tin plate for various CPU and RAM.
Suitable for soldering and fastening in DIY and outdoor projects.

A103 Universal Bga Stencil For Android Qualcomm HiSilicon Mtk Msm Sa OV Max  Ipad Cpu Ram Pm Power Ic Reballing Stencil Tin Plate for Xiaomi Realme Oppo Vivo Samsung
Universal Bga Stencil for Android Qualcomm, HiSilicon, Mtk, Msm.
Compatible with Xiaomi, Realme, Oppo, Vivo, Samsung and more.
Ideal for reballing stencil tin plate for various CPU and RAM.
Suitable for soldering and fastening in DIY and outdoor projects.