Picture of Pm:2 Bga Reballing Stencil Template For Qualcomm Pm Power Ic Chip Solder Tin Planting Net - Soldering Iron Black
Picture of Pm:2 Bga Reballing Stencil Template For Qualcomm Pm Power Ic Chip Solder Tin Planting Net - Soldering Iron Black

Pm:2 Bga Reballing Stencil Template For Qualcomm Pm Power Ic Chip Solder Tin Planting Net - Soldering Iron Black

Category:
SKU: MOS895450
Seller: Module Shop
Tk 500
0 review(s)
  • PM:2 Qualcom Power IC Reballing Tin Plate
  • Material: Imported Japan Steel Sheet
  • Color: As Picture Show
  • Type: BGA Reballing Stencil Template
  • Good steel sheet, 100% new brand and high quality.
  • High quality Direct Heating BGA rework reballing stencil set.
  • it is used for professional reballing operation on Samsung Huawei LG MTK BGA IC chips.
  • Prevent bulges and avoid hump on the BGA reballing stencil template.
  • BGA reball stencil kit offer with the best BGA Repair solution for Huawei circuit board.
  • Phone BGA reballing Kit for rework station.
  • #soldering iron

Call For Order : 09613-800800






  • PM:2 Qualcom Power IC Reballing Tin Plate
  • Material: Imported Japan Steel Sheet
  • Color: As Picture Show
  • Type: BGA Reballing Stencil Template
  • Good steel sheet, 100% new brand and high quality.
  • High quality Direct Heating BGA rework reballing stencil set.
  • it is used for professional reballing operation on Samsung Huawei LG MTK BGA IC chips.
  • Prevent bulges and avoid hump on the BGA reballing stencil template.
  • BGA reball stencil kit offer with the best BGA Repair solution for Huawei circuit board.
  • Phone BGA reballing Kit for rework station.
  • #soldering iron
Customer Questions and answers :

Login to ask a question