MT:1 MT2 MTK Mediatek Power IC Reballing Stencil Template For MT6311P MT6332P MT6328V MT6323LGA MT6165V MT6320 MT6176V MT6329A MT6628QP Professional Phone Soldering Rework Repair MT:1 Reballing Stencil

Name: MT:1 MT2 MTK Mediatek Power IC Reballing Stencil Template For MT6311P MT6332P MT6328V MT6323LGA MT6165V MT6320 MT6176V MT6329A MT6628QP Professional Phone Soldering Rework Repair MT:1 Reballing Stencil
SKU: MOS896571
Price: 450.00 BDT
Availability: InStock

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SKU: MOS896571

Seller: Module Shop

Tk 450

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19 in 1 MTK MT Series Power IC BGA Rework Reballing Stencil Template kit for Phone Professional Soldering Rework Repair
0.12MM MTK phones power IC Repair BGA Rework Reballing Stencil Template kit, with imported steel material and heat dissipating holes for professional soldering rework repairs. MT6311P MT6339A MT6155A MT66280P power IC BGA Reballing Stencil Template, it will offer the best solution for mobile phone rework repairs.
The soldering process is complicated,oldering/replacing chips must be operated by engineers who have proficient skills.
As BGA chips are fragile, complicatedly structured, with numerous balls
any slightly faulty positioning
careless temperature-control or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering.
BGA chips are easily get broken by improper soldering. Before buying, you should consider 3 points:
1) Have you bought the right chips?
2) Do you have proper equipment?
3) Are you skillful enough to solder the chips?

Call For Order : 09613-800800

19 in 1 MTK MT Series Power IC BGA Rework Reballing Stencil Template kit for Phone Professional Soldering Rework Repair

0.12MM MTK phones power IC Repair BGA Rework Reballing Stencil Template kit, with imported steel material and heat dissipating holes for professional soldering rework repairs. MT6311P MT6339A MT6155A MT66280P power IC BGA Reballing Stencil Template, it will offer the best solution for mobile phone rework repairs.
The soldering process is complicated,oldering/replacing chips must be operated by engineers who have proficient skills.
As BGA chips are fragile, complicatedly structured, with numerous balls
any slightly faulty positioning
careless temperature-control or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering.
BGA chips are easily get broken by improper soldering. Before buying, you should consider 3 points:
1) Have you bought the right chips?
2) Do you have proper equipment?
3) Are you skillful enough to solder the chips?

19 in 1 MTK MT Series Power IC BGA Rework Reballing Stencil Template kit for Phone Professional Soldering Rework Repair
0.12MM MTK phones power IC Repair BGA Rework Reballing Stencil Template kit, with imported steel material and heat dissipating holes for professional soldering rework repairs. MT6311P MT6339A MT6155A MT66280P power IC BGA Reballing Stencil Template, it will offer the best solution for mobile phone rework repairs.
The soldering process is complicated,oldering/replacing chips must be operated by engineers who have proficient skills.
As BGA chips are fragile, complicatedly structured, with numerous balls
any slightly faulty positioning
careless temperature-control or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering.
BGA chips are easily get broken by improper soldering. Before buying, you should consider 3 points:
1) Have you bought the right chips?
2) Do you have proper equipment?
3) Are you skillful enough to solder the chips?