Koocu advanced BGA IC Paste SN63/PB67 183°C Solder Paste Tin Mix IC Rebbling Paste iPhone Xiaomi Vivo Realme Samsung Huawe Chip replace BGA Rebuking Soldier

Name: Koocu advanced BGA IC Paste SN63/PB67 183°C Solder Paste Tin Mix IC Rebbling Paste iPhone Xiaomi Vivo Realme Samsung Huawe Chip replace BGA Rebuking Soldier
SKU: MOS896067
Price: 350.00 BDT
Availability: InStock

Category: Electrical Accessories

SKU: MOS896067

Seller: Module Shop

Tk 350

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Koocu No-clean Soldering Paste Sn63/Pb67 183°C Solder Paste for iphone mobile phone BGA Reballing Soldering
Koocu Solder Paste Flux-RL-400 RL-401 RL-402 183°C Solder Tin Sn63/Pb67 20-38um, Koocu Solder Paste, Unique manufacturing of solder past
technology, giving a new definition of tin-base technology
KoocuNo-clean Soldering Paste RL-402 Sn63/Pb67 183°C Solder Paste
183°C Solder paste with high quality
Solder wicking is strong
Less residual
No clean

Call For Order : 09613-800800

Koocu No-clean Soldering Paste Sn63/Pb67 183°C Solder Paste for iphone mobile phone BGA Reballing Soldering
Koocu Solder Paste Flux-RL-400 RL-401 RL-402 183°C Solder Tin Sn63/Pb67 20-38um, Koocu Solder Paste, Unique manufacturing of solder past
technology, giving a new definition of tin-base technology
KoocuNo-clean Soldering Paste RL-402 Sn63/Pb67 183°C Solder Paste
183°C Solder paste with high quality
Solder wicking is strong
Less residual
No clean