Picture of HU2 BGA Reballing Stencil For Huawei Hi6250 HI6220 Hi3660 HI6620 Hi CPU RAM IC Chip Steel Mesh Tin Plant Net Repair Tools HU:2
Picture of HU2 BGA Reballing Stencil For Huawei Hi6250 HI6220 Hi3660 HI6620 Hi CPU RAM IC Chip Steel Mesh Tin Plant Net Repair Tools HU:2

HU2 BGA Reballing Stencil For Huawei Hi6250 HI6220 Hi3660 HI6620 Hi CPU RAM IC Chip Steel Mesh Tin Plant Net Repair Tools HU:2

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SKU: MOS896192
Seller: Module Shop
Tk 200
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  • BGA Stencil for HiSilicon HUAWEi
  •  planting solder template for Hisilicon Huawei 6260 3670 3680 BGA reballing stencil.
  • Compatible Models:
  • HiSilicon HUAWEI HI6260
  • HiSilicon HUAWEI HI3660 B
  • HiSilicon HUAWEI HI6220
  • HiSilicon HUAWEI HI6250
  • HiSilicon HUAWEI HI3660 A
  • HiSilicon HUAWEI HI6620
  • Place of Origin: China
  • Model Number: HU:2
  • Material: Steel
  • Usage: Reballing
  • Color: silver
  • Weight: 25g
  • Operating Temperature: -50~500C

Call For Order : 09613-800800

HU2 BGA Reballing Stencil For Huawei Hi6250 HI6220 Hi3660 HI6620 Hi CPU RAM IC Chip Steel Mesh Tin Plant Net Repair Tools






  • BGA Stencil for HiSilicon HUAWEi
  •  planting solder template for Hisilicon Huawei 6260 3670 3680 BGA reballing stencil.
  • Compatible Models:
  • HiSilicon HUAWEI HI6260
  • HiSilicon HUAWEI HI3660 B
  • HiSilicon HUAWEI HI6220
  • HiSilicon HUAWEI HI6250
  • HiSilicon HUAWEI HI3660 A
  • HiSilicon HUAWEI HI6620
  • Place of Origin: China
  • Model Number: HU:2
  • Material: Steel
  • Usage: Reballing
  • Color: silver
  • Weight: 25g
  • Operating Temperature: -50~500C
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