Bga Stencil A104 For Android Mtk Msm OV Samsung Huawei Xiaomi Ipad Cpu Ram Pm Power Ic Reball - Soldering Iron

Item Type: BGA Reballing Stencil

Material: Stainless Steel

Size: Standard Size

Color: Silver

These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.

Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.

High success rate of planting tin, the solder balls can be formed once when you are proficient.

Simple and convenient to use.

BGA Reballing Stencil only, other accessories demo in the picture is not included!

Note:

No retail package.

Transition: 1cm=10mm=0.39inch

Please allow 1-3mm error due to manual measurement. pls make sure you do not mind before you bid.

Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!

#soldering iron

• Item Type: BGA Reballing Stencil
• Material: Stainless Steel
• Size: Standard Size
• Color: Silver
• These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
• Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
• High success rate of planting tin, the solder balls can be formed once when you are proficient.
• Simple and convenient to use.
• BGA Reballing Stencil only, other accessories demo in the picture is not included!
• Note:
• No retail package.
• Transition: 1cm=10mm=0.39inch
• Please allow 1-3mm error due to manual measurement. pls make sure you do not mind before you bid.
• Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!
• #soldering iron