Picture of BGA Reballing Stencil Template 0.3/0.35/0.4/0.5mm for Vivo Oppo Xiaomi Huawei Master Series IC Steel Net
Picture of BGA Reballing Stencil Template 0.3/0.35/0.4/0.5mm for Vivo Oppo Xiaomi Huawei Master Series IC Steel Net

BGA Reballing Stencil Template 0.3/0.35/0.4/0.5mm for Vivo Oppo Xiaomi Huawei Master Series IC Steel Net

Category:
SKU: MOS896184
Seller: Module Shop
Tk 450
0 review(s)
  • Material: Steel Sheet
  • Color: As Picture Show
  • Type: BGA Reballing Stencil Template
  • Design: Steel Sheet
  • 100%: High-Quality
  • Application: for Huawei Xiaomi Motherboard Repairing BGA Reballing
  • Unit Type: Piece
  • Suit for: for BT Wifi RF series chip /EMMC /Vivo Oppo/0.3/0.35/0.4/0.5mm/PMIC power ic CPU BGA Reballing
  • Function: Phone BGA Reballing Kit for Rework Station
  • What's in the Package
  • 1*Huawei Xiaomi BGA Rebaling Stencil Template
  • 0.4X32X3 Universal Steel Stencil
  • 0.35X48X4 Universal Steel Stencil
  • 0.4X48X4 Universal Steel Stencil
  • 0.4X25X2 Universal Steel Stencil
  • 0.35X 35X3 Universal Steel Stencil
  • 0.4X35X3 Universal Steel Stencil
  • 0.5X38X3 Universal Steel Stencil
  • 0.3/0.35/0.4 0.5 mm
  • N 0.3/0.35 04 05mm Universal Steel Stencil

Call For Order : 09613-800800
  • Material: Steel Sheet
  • Color: As Picture Show
  • Type: BGA Reballing Stencil Template
  • Design: Steel Sheet
  • 100%: High-Quality
  • Application: for Huawei Xiaomi Motherboard Repairing BGA Reballing
  • Unit Type: Piece
  • Suit for: for BT Wifi RF series chip /EMMC /Vivo Oppo/0.3/0.35/0.4/0.5mm/PMIC power ic CPU BGA Reballing
  • Function: Phone BGA Reballing Kit for Rework Station
  • What's in the Package
  • 1*Huawei Xiaomi BGA Rebaling Stencil Template
  • 0.4X32X3 Universal Steel Stencil
  • 0.35X48X4 Universal Steel Stencil
  • 0.4X48X4 Universal Steel Stencil
  • 0.4X25X2 Universal Steel Stencil
  • 0.35X 35X3 Universal Steel Stencil
  • 0.4X35X3 Universal Steel Stencil
  • 0.5X38X3 Universal Steel Stencil
  • 0.3/0.35/0.4 0.5 mm
  • N 0.3/0.35 04 05mm Universal Steel Stencil





  • Material: Steel Sheet
  • Color: As Picture Show
  • Type: BGA Reballing Stencil Template
  • Design: Steel Sheet
  • 100%: High-Quality
  • Application: for Huawei Xiaomi Motherboard Repairing BGA Reballing
  • Unit Type: Piece
  • Suit for: for BT Wifi RF series chip /EMMC /Vivo Oppo/0.3/0.35/0.4/0.5mm/PMIC power ic CPU BGA Reballing
  • Function: Phone BGA Reballing Kit for Rework Station
  • What's in the Package
  • 1*Huawei Xiaomi BGA Rebaling Stencil Template
  • 0.4X32X3 Universal Steel Stencil
  • 0.35X48X4 Universal Steel Stencil
  • 0.4X48X4 Universal Steel Stencil
  • 0.4X25X2 Universal Steel Stencil
  • 0.35X 35X3 Universal Steel Stencil
  • 0.4X35X3 Universal Steel Stencil
  • 0.5X38X3 Universal Steel Stencil
  • 0.3/0.35/0.4 0.5 mm
  • N 0.3/0.35 04 05mm Universal Steel Stencil
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