A104 Bga Stencil For Android Mtk Msm OV Samsung Huawei Xiaomi Ipad Cpu Ram Pm Power Ic Reball - Soldering Iron

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Step 3: Introducing the A104 Bga Stencil for MTK, MSM, Samsung, Huawei, Xiaomi, iPad CPU, RAM, PM, Power IC Reball - Soldering Iron. This versatile stencil is designed for precise reballing of various electronic components, including CPUs, RAM, and power ICs. Compatible with a wide range of devices, it is an essential tool for professionals and DIY enthusiasts in the electronics repair and soldering industry.


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The A104 Bga Stencil is a must-have for anyone working with electronics, offering precision and compatibility across a range of devic

• Item Type: BGA Reballing Stencil
• Material: Stainless Steel
• Size: Standard Size
• Color: Silver
• These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
• Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
• High success rate of planting tin, the solder balls can be formed once when you are proficient.
• Simple and convenient to use.
• BGA Reballing Stencil only, other accessories demo in the picture is not included!
• Note:
• No retail package.
• Transition: 1cm=10mm=0.39inch
• Please allow 1-3mm error due to manual measurement. pls make sure you do not mind before you bid.
• Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!
• #soldering iron